Interconnection of printed circuit boards with nanowires

A method of manufacturing a carrier assembly, the method comprising:

• providing a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending from a first extremity to a second extremity of the elongated shape of the first carrier sub-assembly, said at least one electrically conductive layer extending up to a first area provided on one of the first and second extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area;
• providing a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on said second area;
• stacking said first carrier sub-assembly and said second carrier sub-assembly connecting one to each other through the connection of the first plurality of nanowires with the second plurality of nanowires.