H05K 2201/0385
Displaced conductors
H05K2201/0385 (Displaced conductors) appears on 7 US grants and 10 published applications in this corpus.
Search patents in H05K- Granted patents
- 7
- Published applications
- 10
- Assignees
- 9
- Inventors
- 25
- Latest grant
- 21 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 3 |
| 2014 | 1 | 0 |
| 2015 | 0 | 1 |
| 2016 | 2 | 0 |
| 2017 | 1 | 1 |
| 2018 | 1 | 1 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year.
Recent patents
- Electronic device and multi-level interposer with RF sloped via and related method21 Jan 2025US 12,205,880 B2Eagle Technology, LLC
- Flexible device including sliding interconnection structure6 Feb 2018US 9,888,567 B2SK hynix Inc.
- Semiconductor module having a tab pin with no tie bar17 Oct 2017US 9,793,034 B2Samsung Electronics Co., Ltd.
- Electronic component24 May 2016US 9,349,549 B2Novalia Ltd.
- Wired circuit board and producing method thereof19 Jan 2016US 9,241,410 B2Nitto Denko Corporation
- Electronic device and multi-level interposer with rf sloped via and related method21 Sep 2023US 2023/0298988 A1Eagle Technology, LLC
- Electronic device3 Oct 2019US 2019/0306973 A1Fujitsu Limited
- Flexible sensor4 Jan 2018US 2018/0004318 A1
- Flexible device including sliding interconnection structure2 Mar 2017US 2017/0064832 A1SK hynix Inc.
- Semiconductor module having a tab pin with no tie bar24 Dec 2015US 2015/0373848 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Process for producing a collapsed filled via hole10US 7,178,233 B2Mitsui Mining & Smelting Co., Ltd. · 2007
- Semiconductor module having a tab pin with no tie bar5US 9,793,034 B2Samsung Electronics Co., Ltd. · 2017
- Wired circuit board and producing method thereof4US 9,241,410 B2Nitto Denko Corporation · 2016
- Circuit board with thermo-conductive pillar3US 8,698,186 B2Cofan USA, Inc. · 2014