Flexible device including sliding interconnection structure
AssigneeSK hynix Inc.
InventorsSeung Yeop Lee, Joo Hyun Kang, Jong Hoon Kim, Han Jun Bae
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Abstract
A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.
Claims14
A flexible device comprising:
- a first conductive pattern including a first sliding contact portion and a first extension portion;
- a second conductive pattern including a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion, the second sliding contact portion being in contact with the first sliding contact portion and being movable on the first sliding contact portion for a sliding motion;
- and
- a dielectric layer in which the first and second conductive patterns are embedded,
- wherein the dielectric layer comprises:
- a first dielectric layer disposed on the first conductive pattern;
- and
- a second dielectric layer disposed on the second conductive pattern, and
- wherein the first dielectric layer directly contacts the second dielectric layer.
A flexible device comprising:
- a package substrate including a dielectric layer directly contacting a first surface of a substrate body, a first sliding interconnection structure disposed between the dielectric layer and the first surface of the substrate body to have a first conductive pattern and a second conductive pattern, and a second sliding interconnection structure disposed on a second surface of the substrate body opposite to the dielectric layer;
- and
- a chip mounted on the package substrate and electrically connected to the first sliding interconnection structure,
- wherein the first conductive pattern has a first sliding contact portion and a first extension portion,
- wherein the second conductive pattern has a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion, and
- wherein the second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion.
Dependencies are inferred from the claim text.