Semiconductor module having a tab pin with no tie bar

A semiconductor module, comprising:

• a printed circuit board including an integrated circuit chip and a buffer for the integrated circuit chip;
• connecting terminals at an edge of the printed circuit board;
• first signal lines to respectively connect electrical connection pads of the buffer to the connecting terminals, wherein the first signal lines are in an interior layer of the printed circuit board and wherein the connecting terminals are plated by first via-holes of the printed circuit board and are respectively connected to the first signal lines;
• second signal lines including second via-holes respectively connect electrical connection pads of the integrated circuit chip to the connecting terminals, and
• plating lines connected to the second via-holes.

A printed circuit board, comprising:

• a substrate;
• a plating line;
• at least one connecting terminal;
• at least one signal line connected between an electrical connection pad of an integrated circuit chip and the at least one connecting terminal;
• at least one via hole including a conductive material connected to the at least one signal line;
• and
• a termination resistor connected to the at least one via hole, wherein the at least one signal line is in an interior layer of the substrate, wherein the at least one connecting terminal is a plated terminal which is connected to the at least one via hole through the plating line, and wherein the plating line is in an inner layer of the printed circuit board.