Back to results
US 9,241,410 B2Granted
Wired circuit board and producing method thereof
AssigneeNitto Denko Corporation
InventorsSaori Ishigaki, Jun Ishii, Yoshito Fujimura, Yuu Sugimoto
Life of this patent
Estimating the term…
Abstract
A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.
Claims7
A wired circuit board, comprising:
- an insulating layer;
- and
- a conductive layer including a wire covered with the insulating layer and a terminal, which is continued to the wire, for being electrically connected to an electronic element,
- wherein the insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction so as to form a plurality of indented lower walls and at least one upper wall joined to the lower walls by connecting walls, to thereby increase a contact area between the terminal and a connecting medium for connecting the electronic element to the terminal,
- wherein the connecting medium comprises a conductive adhesive,
- wherein the terminal is used by electrically connecting to a terminal of the electronic element via the conductive adhesive, and
- wherein the terminal of the wired circuit board is completely physically separated from the terminal of the electronic element by the conductive adhesive interposed therebetween.
4 more elements
A method of producing a wired circuit board, comprising the steps of:
- preparing a metal supporting board;
- forming an insulating base layer at one side of the metal supporting board in a thickness direction thereof such that a terminal formation region including a pattern opening exposing the metal supporting board with a pattern shape and a pattern insulating portion defined by the pattern opening is formed therein;
- forming a conductive layer such that the conductive layer includes a wire formed at side of the insulating base layer in the thickness direction and a terminal formed in the terminal formation region to be continued to the wire;
- and
- forming a support opening and a base opening each corresponding to the terminal formation region respectively in the metal supporting board and the insulating layer to form the terminal into a pattern which is exposed from each of the support opening and the base opening and indented in the thickness direction so as to form a plurality of indented lower walls and at least one upper wall joined to the lower walls by connecting walls, to thereby increase a contact area between the terminal and a connecting medium for connecting an electronic element to the terminal,
- wherein the connecting medium comprises a conductive adhesive,
- wherein the terminal is used by electrically connecting to a terminal of the electronic element via the conductive adhesive, and
- wherein the terminal of the wired circuit board is completely physically separated from the terminal of the electronic element by the conductive adhesive interposed therebetween.
5 more elements
Dependencies are inferred from the claim text.