Electronic device and multi-level interposer with RF sloped via and related method
AssigneeEagle Technology, LLC
InventorsMatt Bauer, Timothy Clingenpeel, Beatriz Jimenez
Life of this patent
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Abstract
An electronic device may include an IC, a grid array substrate, and a multi-level interposer coupled between the IC and the grid array substrate. The multi-level interposer may have dielectric layers, and a sequence of metal levels carried by respective dielectric layers, and an RF sloped via including a sloped metal signal layer extending from a first metal level, through a second metal level, and to a third metal level, and a respective sloped lateral metal ground layer adjacent each side of the sloped metal signal layer.
Claims18
An electronic device comprising:
- at least one integrated circuit (IC);
- a grid array substrate;
- and
- a multi-level interposer coupled between the at least one IC and the grid array substrate, the multi-level interposer comprising
- a plurality of dielectric layers, and a sequence of metal levels carried by respective dielectric layers, and
- a radio frequency (RF) sloped via comprising
- a sloped metal signal layer extending from a first metal level, through a second metal level, and to a third metal level, and
- a respective sloped lateral metal ground layer spaced from and adjacent each lateral side of the sloped metal signal layer in a coplanar configuration.
A multi-level interposer to be coupled between at least one IC and a grid array substrate, the multi-level interposer comprising:
- a plurality of dielectric layers, and a sequence of metal levels carried by respective dielectric layers;
- and
- a radio frequency (RF) sloped via comprising
- a sloped metal signal layer extending from a first metal level, through a second metal level, and to a third metal level, and
- a respective sloped lateral metal ground layer spaced from and adjacent each lateral side of the sloped metal signal layer in a coplanar configuration.
A method for making a multi-level interposer to be coupled between at least one IC and a grid array substrate, the method comprising:
- forming a plurality of dielectric layers, and a sequence of metal levels carried by respective dielectric layers;
- and
- forming a radio frequency (RF) sloped via comprising
- a sloped metal signal layer extending from a first metal level, through a second metal level, and to a third metal level, and
- a respective sloped lateral metal ground layer spaced from and adjacent each lateral side of the sloped metal signal layer in a coplanar configuration.
Dependencies are inferred from the claim text.