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US 8,698,186 B2Granted
Circuit board with thermo-conductive pillar
AssigneeCofan USA, Inc.
InventorsLac Nguyen, Chang Han
Life of this patent
Estimating the term…
Abstract
An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.
Claims19
A circuit board LED support structure comprising:
- a substrate having a substrate top surface and comprising a pillar having a pillar top surface, wherein the pillar top surface is in the plane substantially parallel with the plane of the substrate top surface and is raised in relation to the substrate top surface;
- a dielectric layer having dielectric layer top surface and arranged on the substrate top surface, covering at least a portion of the substrate top surface and not covering the pillar top surface;
- and
- electrode pads and circuit traces arranged on the dielectric layer top surface, wherein at least one pocket on a bottom surface of the substrate is filled with thermally-conductive material.
1 more element
A circuit board LED support structure comprising:
- a substrate having a substrate top surface, a substrate bottom surface and walls substantially perpendicular to the substrate top surface and the substrate bottom surface, the walls defining an opening in the substrate;
- a column having a column top surface and a column profile substantially the same as the substrate opening, the height of the column exceeding the thickness of the substrate, wherein the column is arranged at least partially in the opening such that at least a top portion of the column is above the substrate top surface and the column top surface is in the plane substantially parallel to the plane of the substrate top surface;
- a dielectric layer having dielectric layer top surface and arranged on the substrate top surface, covering at least a portion of the substrate top surface and not covering the column top surface;
- and
- electrode pads and circuit traces arranged on the dielectric layer top surface.
2 more elements
An LED device comprising:
- an circuit board LED support structure comprising:
- a substrate having a substrate top surface and comprising a pillar having a pillar top surface, wherein the pillar top surface is in the plane substantially parallel with the plane of the substrate top surface and is raised in relation to the substrate top surface;
- a dielectric layer having dielectric layer top surface and arranged on the substrate top surface, covering at least a portion of the substrate top surface and not covering the pillar top surface;
- and
- electrode pads and circuit traces arranged on the dielectric layer top surface;
- and
- an LED package comprising:
- an LED die;
- LED electrodes;
- and
- LED bottom plate,
- wherein the LED package is arranged on the substrate so that the LED bottom plate is in contact with the pillar top surface.
9 more elements
A method of forming a circuit board LED support structure comprising:
- providing a substrate having a top surface;
- shaping substrate to form a pillar having a pillar top surface, wherein the pillar top surface is in a plane substantially parallel with a plane of the substrate top surface and is raised in relation to the substrate top surface;
- arranging a dielectric layer having dielectric layer top surface on the substrate top surface, covering at least a portion of the substrate top surface without covering the pillar top surface;
- arranging electrode pads and circuit traces on the dielectric layer top surface;
- and
- filling pockets on bottom of the substrate with thermally-conductive material.
3 more elements
A method of forming a circuit board LED support structure comprising:
- providing a substrate having a top surface;
- forming a mesa-shaped piece;
- attaching the mesa-shaped piece to the substrate top surface to form a pillar having a pillar top surface in the plane substantially parallel with the plane of the substrate top surface and raised in relation to the substrate top surface;
- arranging a dielectric layer having dielectric layer top surface on the substrate top surface, covering at least a portion of the substrate top surface and not covering the pillar top surface;
- and
- arranging electrode pads and circuit traces on the dielectric layer top surface.
3 more elements
A method of forming a circuit board LED support structure comprising:
- providing a substrate having a substrate top surface, a substrate bottom surface and walls substantially perpendicular to the substrate top surface and the substrate bottom surface, the walls defining an opening in the substrate,
- forming a column having a column top surface and a column profile substantially the same as the substrate opening, the height of the column exceeding the thickness of the substrate;
- arranging the column at least partially in the opening such that at least a top portion of the column is above the substrate top surface and the column top surface is in the plane substantially parallel to the plane of the substrate top surface;
- arranging a dielectric layer having dielectric layer top surface on the substrate top surface, covering at least a portion of the substrate top surface and not covering the column top surface;
- and
- arranging electrode pads and circuit traces on the dielectric layer top surface.
3 more elements
Dependencies are inferred from the claim text.