Electronic device
AssigneeFujitsu Limited
InventorShunji Baba
Life of this patent
Estimating the term…
Abstract
An electronic device includes a first substrate having bendability, a second substrate configured to include a first electrode and provided over the first substrate, a third substrate configured to include a second electrode and provided over the first substrate with a space from the second substrate, a first electronic component configured to be electrically coupled to the first electrode and provided over the second substrate, a second electronic component configured to be electrically coupled to the second electrode and provided over the third substrate, and a wiring configured to include a plurality of conductive thread-shaped members sewn into the first substrate in an extensible and contractible state so as to be electrically coupled the first electrode to the second electrode.
Claims14
An electronic device comprising:
- a first substrate having bendability;
- a second substrate configured to include a first electrode and provided over the first substrate;
- a third substrate configured to include a second electrode and provided over the first substrate with a space from the second substrate;
- a first electronic component configured to be electrically coupled to the first electrode and provided over the second substrate;
- a second electronic component configured to be electrically coupled to the second electrode and provided over the third substrate;
- and
- a wiring configured to include a plurality of conductive thread-shaped members sewn into the first substrate in an extensible and contractible state so as to be electrically coupled the first electrode to the second electrode.
Dependencies are inferred from the claim text.