H05K 2201/0379
Stacked conductors
H05K2201/0379 (Stacked conductors) appears on 225 US grants and 211 published applications in this corpus.
Search patents in H05K- Granted patents
- 225
- Published applications
- 211
- Assignees
- 138
- Inventors
- 534
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 12 | 9 |
| 2002 | 15 | 16 |
| 2003 | 12 | 11 |
| 2004 | 8 | 11 |
| 2005 | 14 | 12 |
| 2006 | 3 | 8 |
| 2007 | 8 | 19 |
| 2008 | 6 | 14 |
| 2009 | 8 | 11 |
| 2010 | 9 | 17 |
| 2011 | 7 | 8 |
| 2012 | 11 | 6 |
| 2013 | 12 | 2 |
| 2014 | 6 | 5 |
| 2015 | 6 | 7 |
| 2016 | 4 | 2 |
| 2017 | 5 | 4 |
| 2018 | 3 | 1 |
| 2019 | 2 | 4 |
| 2020 | 1 | 6 |
| 2021 | 7 | 10 |
| 2022 | 11 | 8 |
| 2023 | 3 | 9 |
| 2024 | 5 | 4 |
| 2025 | 5 | 4 |
| 2026 | 6 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Carrier assembly and method for producing a carrier assembly21 Apr 2026US 12,610,474 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit module3 Mar 2026US 12,568,583 B2Murata Manufacturing Co., Ltd.
- Wiring substrate24 Feb 2026US 12,563,664 B2Ibiden Co., Ltd.
- Circuit board structure and manufacturing method thereof10 Feb 2026US 12,550,246 B2Unimicron Technology Corp.
- Circuit structure18 Jun 2026US 2026/0173262 A1Advanced Semiconductor Engineering, Inc.
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring board, electronic component mounting package including wiring board, and electronic module26 Feb 2026US 2026/0059654 A1KYOCERA Corporation
- Process for manufacturing a printed circuit board and printed circuit board11 Sep 2025US 2025/0287511 A1
- Circuit board12 Jun 2025US 2025/0193994 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Low cost chip size package and method of fabricating the same204US 6,181,569 B22001
- Surface mount solder assembly of leadless integrated circuit packages to substrates197US 5,346,118 AAT&T Bell Laboratories · 1994
- Method for fabricating an electronic device having solder joints186US 5,641,113 AOki Electronic Industry Co., Ltd. · 1997
- Method of forming an adhesive connection136US 6,077,380 AMicroFab Technologies, Inc. · 2000