Carrier assembly and method for producing a carrier assembly
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorMarco Gavagnin
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Abstract
Described herein is a component carrier, wherein the component carrier comprises a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein a first of said electrically conductive layer structures comprises a first surface where a first plurality of conductive nanowires is connected and a second of said electrically conductive layer structures comprises a second surface where a second plurality of conductive nanowires is connected, wherein said first and second surfaces and said first and second pluralities of nanowires are configured to at least partially connect the nanowires of the first plurality of nanowires with the respective nanowires of the second plurality of nanowires.
Claims12
A component carrier, wherein the component carrier comprises:
- a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein a first of said electrically conductive layer structures comprises a first surface where a first plurality of conductive nanowires is connected and a second of said electrically conductive layer structures comprises a second surface where a second plurality of conductive nanowires is connected, wherein said first and second surfaces and said first and second pluralities of nanowires are configured to at least partially connect the nanowires of the first plurality of nanowires with the respective nanowires of the second plurality of nanowires;
- wherein said pluralities of nanowires comprise a plurality of vertical nanowires, which extend vertically with respect to a stack thickness direction from a planar surface of the respective first and second surfaces,
- wherein said first and second surfaces and said first and second pluralities of nanowires are configured to at least partially intertangle said first and second pluralities of nanowires one to each other, and
- wherein an average length ratio of each nanowire contacting at least one adjacent nanowire with respect to a respective entire nanowire length is at least 5%.
A method of manufacturing a component carrier, the method comprising:
- providing a first layer comprising a first plurality of conductive nanowires extending from a surface of said layer;
- providing a second layer comprising a second plurality of nanowires extending from a surface of said layer;
- wherein said pluralities of nanowires comprise a plurality of vertical nanowires, which extend vertically with respect to a stack thickness direction from a planar surface of the respective first and second surfaces;
- stacking said first layer with said second layer so that at least one of said first plurality of nanowires and at least one of said second plurality of nanowires are intertangled one to each other;
- wherein an average length ratio of each nanowire contacting at least one adjacent nanowire with respect to a respective entire nanowire length is at least 5%.
Dependencies are inferred from the claim text.