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US 12,550,246 B2Granted
Circuit board structure and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorChun Hung Kuo
Life of this patent
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Abstract
A circuit board structure includes a build-up structure, a graphene layer disposed on the build-up structure, and at least one conductive pillar disposed on the graphene layer, the graphene layer includes an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar, and the at least one conductive pillar is electrically connected to the build-up structure via the non-oxidized area.
Claims14
A circuit board structure, comprising:
- a build-up structure;
- a graphene layer disposed on the build-up structure;
- and
- at least one conductive pillar disposed on the graphene layer;
- wherein the graphene layer comprises an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar, and the at least one conductive pillar is electrically connected to the build-up structure via the non-oxidized area.
2 more elements
A manufacturing method of a circuit board structure, comprising:
- providing a carrier;
- forming a graphene layer on the carrier;
- forming a build-up structure on the graphene layer;
- removing the carrier from the graphene layer;
- disposing at least one conductive pillar on the graphene layer;
- and
- performing an oxidation treatment on the graphene layer so as to form an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar on the graphene layer.
4 more elements
Dependencies are inferred from the claim text.