Wiring board, electronic component mounting package including wiring board, and electronic module
AssigneeKYOCERA Corporation
InventorYoshiki KAWAZU
Life of this patent
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AssigneeKYOCERA Corporation
InventorYoshiki KAWAZU
Estimating the term…
A wiring board includes a first insulating layer, a second insulating layer, a first ground conductor, and a first signal conductor. The first insulating layer includes a first upper surface and a first lower surface. The second insulating layer is positioned on the first insulating layer and includes a second upper surface and a second lower surface. The first ground conductor is positioned on the first lower surface and includes a first opening and a second opening. The first signal conductor includes a first line positioned on the first upper surface and a second line positioned on the second lower surface. The first line includes a first end portion and a first line portion. The second line includes a second end portion electrically connected to the first end portion, and a second line portion. The first opening is larger in area than the second opening in a planar view.
A wiring board comprising:
Dependencies are inferred from the claim text.