Wiring substrate
AssigneeIbiden Co., Ltd.
InventorAtsushi Deguchi
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes a resin insulating layer, and a conductor layer formed on the resin insulating layer and including a seed layer and a metal film formed on the seed layer such that the conductor layer has wiring patterns including wirings. The conductor layer is formed such that each of the wirings in the wiring patterns has undercut parts on side surfaces extending to the resin insulating layer, and the wirings in the conductor layer include outer wirings formed such that each of the outer wirings has the undercut part on the side surface facing an adjacent one of the wirings is smaller than the undercut part on the side surface farther from the adjacent one of the wirings.
Claims20
A wiring substrate, comprising:
- a resin insulating layer;
- and
- a conductor layer formed on the resin insulating layer and comprising a seed layer and a metal film formed on the seed layer such that the conductor layer has a plurality of wiring patterns comprising a plurality of wirings,
- wherein the conductor layer is formed such that each of the wirings in the plurality of wiring patterns has undercut parts on side surfaces extending to the resin insulating layer, and the plurality of wirings in the conductor layer includes a plurality of outer wirings formed such that the undercut part of each of the outer wirings on the side surface facing an adjacent one of the wirings is smaller than the undercut part of each of the outer wirings on the side surface farther from the adjacent one of the wirings.
Dependencies are inferred from the claim text.