H05K 2201/0367
Metallic bump or raised conductor not used as solder bump
H05K2201/0367 (Metallic bump or raised conductor not used as solder bump) appears on 1,102 US grants and 1,031 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,102
- Published applications
- 1,031
- Assignees
- 404
- Inventors
- 1,958
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 6 | 0 |
| 1990 | 9 | 0 |
| 1991 | 9 | 0 |
| 1992 | 11 | 0 |
| 1993 | 17 | 0 |
| 1994 | 18 | 0 |
| 1995 | 12 | 0 |
| 1996 | 23 | 0 |
| 1997 | 18 | 0 |
| 1998 | 35 | 0 |
| 1999 | 33 | 0 |
| 2000 | 33 | 0 |
| 2001 | 36 | 17 |
| 2002 | 33 | 40 |
| 2003 | 46 | 34 |
| 2004 | 31 | 61 |
| 2005 | 34 | 70 |
| 2006 | 44 | 66 |
| 2007 | 56 | 98 |
| 2008 | 55 | 109 |
| 2009 | 59 | 94 |
| 2010 | 61 | 67 |
| 2011 | 58 | 52 |
| 2012 | 62 | 34 |
| 2013 | 41 | 30 |
| 2014 | 29 | 33 |
| 2015 | 26 | 30 |
| 2016 | 25 | 26 |
| 2017 | 17 | 19 |
| 2018 | 23 | 21 |
| 2019 | 16 | 18 |
| 2020 | 16 | 16 |
| 2021 | 18 | 14 |
| 2022 | 10 | 21 |
| 2023 | 14 | 21 |
| 2024 | 17 | 17 |
| 2025 | 14 | 12 |
| 2026 | 5 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Service board and communication device9 Jun 2026US 12,650,566 B2Huawei Technologies Co., Ltd.
- Vertical power supply system and manufacturing method of connection board21 Apr 2026US 12,610,453 B2Delta Electronics (Shanghai) Co., Ltd.
- Electronic device14 Apr 2026US 12,604,403 B2Denso Corporation
- Electronic device17 Feb 2026US 12,557,435 B2Innolux Corporation
- Circuit board structure and manufacturing method thereof10 Feb 2026US 12,550,246 B2Unimicron Technology Corp.
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Integrated circuit23 Jul 2026US 2026/0215317 A1Pragmatic Semiconductor Limited
- Circuit module and soldered circuit module2 Jul 2026US 2026/0190230 A1Murata Manufacturing Co., Ltd.
- Printed circuit board28 May 2026US 2026/0150189 A1Samsung Electro-Mechanics Co., Ltd.
- Electronic device21 May 2026US 2026/0143859 A1Innolux Corporation
Most cited
By later US patents
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability236US 5,326,428 AMicron Semiconductor, Inc. · 1994
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994