Vertical power supply system and manufacturing method of connection board

A vertical power supply system, comprising:

• a system board comprising a first surface and a second surface, wherein the first surface and the second surface are opposite to each other;
• a substrate comprising a third surface and a fourth surface, wherein the third surface and the fourth surface are opposite to each other, and the third surface of the substrate is located between the fourth surface and the second surface of the system board;
• a chip unit disposed on the first surface;
• a plurality of first capacitors disposed on the second surface, wherein two electrodes of any of the plurality of first capacitors are disposed on the second surface;
• a plurality of second capacitors disposed on the third surface, wherein two electrodes of any of the plurality of second capacitors are disposed on the third surface;
• a plurality of conductive portions, wherein the third surface and the second surface are electrically connected through the plurality of conductive portions;
• and
• a power unit disposed on the fourth surface.