Circuit module and soldered circuit module

A soldered circuit module, comprising:

• a substrate having a first main surface and a second main surface;
• a resin layer disposed on the first main surface of the substrate;
• a connection terminal extending through the resin layer in a thickness direction of the resin layer;
• and
• a solder bump bonded to the connection terminal via an intermetallic compound layer,
• the connection terminal including:
• a first end surface adjacent to the substrate;
• a second end surface opposite to the first end surface;
• and
• a side surface extending between the first and second end surfaces,
• wherein the second end surface is exposed from the resin layer,
• the resin layer includes a recess that extends toward the first main surface of the substrate and surrounds the second end surface of the connection terminal,
• a portion of the side surface of the connection terminal is exposed from the resin layer within the recess,
• the solder bump covers the second end surface of the connection terminal and at least part of the portion of the side surface of the connection terminal exposed within the recess, and
• the intermetallic compound layer is between the connection terminal and the solder bump and covers the second end surface of the connection terminal and at least part of the portion of the side surface of the connection terminal exposed within the recess.

A soldered circuit assembly comprising:

• a circuit module including a substrate, a resin layer on the substrate, and a connection terminal extending through the resin layer, wherein a portion of a side surface of the connection terminal is exposed from the resin layer via a recess formed in the resin layer;
• a solder bump bonded to an end surface of the connection terminal and the exposed portion of the side surface;
• and
• an intermetallic compound layer disposed at an interface between the connection terminal and the solder bump,
• wherein the intermetallic compound layer is vertically offset from a non-recessed outer surface of the resin layer.