Circuit structure and manufacturing method thereof

A method of manufacturing a circuit structure, comprising:

• forming a first circuit layer on a first dielectric material, and forming a plurality of first conductive blind vias connected to the first circuit layer in the first dielectric material;
• forming a conductive bump on each of the plurality of first conductive blind vias;
• forming a second dielectric material on the first circuit layer;
• and
• forming a second circuit layer on the second dielectric material, and forming a plurality of second conductive blind vias connected to the second circuit layer in the second dielectric material, wherein each of the plurality of second conductive blind vias is stacked on a corresponding one of the plurality of first conductive blind vias, and each of the conductive bumps is formed at a junction between a respective one of the plurality of first conductive blind vias and a corresponding one of the plurality of second conductive blind vias.