H05K 2201/0376
Flush conductors, i.e. flush with the surface of the printed circuit
H05K2201/0376 (Flush conductors, i.e. flush with the surface of the printed circuit) appears on 370 US grants and 397 published applications in this corpus.
Search patents in H05K- Granted patents
- 370
- Published applications
- 397
- Assignees
- 207
- Inventors
- 831
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 7 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 7 |
| 2003 | 2 | 5 |
| 2004 | 6 | 10 |
| 2005 | 3 | 6 |
| 2006 | 3 | 9 |
| 2007 | 5 | 12 |
| 2008 | 6 | 23 |
| 2009 | 3 | 20 |
| 2010 | 9 | 22 |
| 2011 | 19 | 17 |
| 2012 | 26 | 22 |
| 2013 | 13 | 17 |
| 2014 | 12 | 46 |
| 2015 | 22 | 28 |
| 2016 | 27 | 31 |
| 2017 | 26 | 15 |
| 2018 | 15 | 19 |
| 2019 | 19 | 10 |
| 2020 | 14 | 16 |
| 2021 | 11 | 10 |
| 2022 | 9 | 19 |
| 2023 | 10 | 9 |
| 2024 | 9 | 11 |
| 2025 | 9 | 3 |
| 2026 | 4 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Method for producing electrical circuitry on filled organic polymers14 Apr 2026US 12,604,413 B2
- Patterned article including metallic bodies10 Mar 2026US 12,573,766 B23M Innovative Properties Company
- Semiconductor package using flip-chip technology17 Feb 2026US 12,557,215 B2Mediatek Inc.
- Semiconductor device having an insulating portion with a top smaller in width than a diameter of a conductive particle, display device, image capturing device, and electronic apparatus28 Oct 2025US 12,457,692 B2Canon Kabushiki Kaisha
- Component Carrier with Different Line Spacing in Metal Traces, and Manufacture Method9 Jul 2026US 2026/0197938 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Semiconductor package using flip-chip technology25 Jun 2026US 2026/0181773 A1Mediatek Inc.
- Electronic device comprising a single dielectric layer for solder mask and cavity and method for fabricating the same25 Jun 2026US 2026/0182422 A1Qorvo US, Inc.
- Circuit board, method for manufacturing circuit board, and electronic device25 Jun 2026US 2026/0182474 A1Fict Limited
- Patterned Article Including Metallic Bodies18 Jun 2026US 2026/0171679 A13M Innovative Properties Company
Most cited
By later US patents
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991
- Method for the production of printed circuit boards125US 6,035,527 AIngenieurbuero Tamm Factory Innovations · 2000
- Multilayer circuit board fabrication process119US 4,915,983 AThe Foxboro Company · 1990