Printed circuit board having an injection molded substrate

A method for manufacturing a circuit board comprising:

• generating a pattern of recesses in a surface of a substrate by forming a trench-shaped depression in the region of an interconnect trace and by forming a planar depression in at least one of (a) the region of a through-connection or (b) the region of a connecting pad, with the depth of said trench-shaped depression being less than the depth of said planar depression;
• and
• applying a metal coat to said substrate so that, as a result of the difference in depth between said trench-shaped depression and said planar depression, said metal coat fills said trench-shaped depression to said surface of said substrate and in said planar depression a distance remains between the metal coat and said surface of said substrate.

A printed circuit board comprising:

• an injection molded substrate having a surface, the surface having a planar depression and a trench-shaped depression disposed therein, the trench-shaped depression having a metal coat to form an interconnect trace, the planar depression having a metal coat to form one of (a) a through-connection or (b) a connecting pad;
• the trench-shaped depression and the planar depression each having a depth, the depth of the planar depression being greater than the depth of the trench-shaped depression so that when the metal coat is applied to the printed circuit board the metal coat fills the trench-shaped depression to the surface of the substrate while a distance remains between the metal coat and the surface of the substrate at the planar depression.