Semiconductor package using flip-chip technology
AssigneeMediatek Inc.
InventorsChe-Ya Chou, Wen-Sung Hsu, Nan-Cheng Chen
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Abstract
A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrier substrate. A portion of the second conductive structure is in contact with the portion of the conductive trace. The semiconductor device further includes a semiconductor body mounted above the conductive trace. The semiconductor body is connected to the second conductive structure.
Claims18
A semiconductor package, comprising:
- a base;
- a carrier substrate bonded to the base via a first conductive structure, the carrier substrate comprising a conductive trace at a top surface facing away from the base and a fourth conductive trace at a bottom surface facing the base, wherein the first conductive structure is shorter than the fourth conductive trace;
- and
- first and second semiconductor dies mounted above the top surface of the carrier substrate, wherein
- the first semiconductor die is connected to the conductive trace via a second conductive structure, and
- the second semiconductor die has an active surface facing away from the conductive trace;
- and
- a molding compound surrounding the second conductive structure and in contact with the conductive trace,
- wherein a projection of the conductive trace is within a projection of the second conductive structure in a top view, and a bottom surface of the conductive trace is lower than a bottom surface of the second conductive structure.
Dependencies are inferred from the claim text.