Modular routable circuit board conductor blocks
AssigneeMicrosoft Technology Licensing, LLC
InventorsJason Harrigan, Kajsa Ava Johnson
Life of this patent
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Abstract
Techniques, elements, and assemblies for high current board-level conductive pathways on printed circuit boards are provided. In one example, a method includes providing a circuit board having footprint elements that define a route between endpoints. The method includes applying solder paste onto the footprint elements, and placing modular conductive blocks along the route onto the solder paste associated with the footprint elements. The method also includes forming, by at least a solder reflow operation, an assembly comprising the circuit board and the modular conductive blocks that establishes a conductive pathway along the route with series coupling of the modular conductive blocks to each other.
Claims8
An assembly, comprising:
- a circuit board comprising a route;
- and
- a board level cable comprising a series of modular blocks;
- the modular blocks comprising:
- cuboid bodies formed from an electrically conductive reflowable solder material;
- and
- faces comprising outer surfaces of the cuboid bodies;
- wherein adjacent modular blocks of the series of modular blocks are directly attached to and reflow soldered at end faces;
- and
- wherein bottom faces of the modular blocks are directly attached to and are reflow soldered to the circuit board using footprint elements placed along the route.
Dependencies are inferred from the claim text.