H05K 2201/037
Hollow conductors, i.e. conductors partially or completely surrounding a void
Official title: Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
H05K2201/037 (Hollow conductors, i.e. conductors partially or completely surrounding a void) appears on 63 US grants and 90 published applications in this corpus.
Search patents in H05K- Granted patents
- 63
- Published applications
- 90
- Assignees
- 49
- Inventors
- 184
- Latest grant
- 16 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 6 |
| 2003 | 0 | 2 |
| 2004 | 5 | 0 |
| 2005 | 2 | 2 |
| 2006 | 1 | 0 |
| 2007 | 0 | 5 |
| 2008 | 0 | 1 |
| 2009 | 1 | 2 |
| 2010 | 0 | 2 |
| 2011 | 0 | 2 |
| 2012 | 0 | 2 |
| 2013 | 0 | 5 |
| 2014 | 4 | 1 |
| 2015 | 1 | 7 |
| 2016 | 6 | 7 |
| 2017 | 2 | 0 |
| 2018 | 4 | 4 |
| 2019 | 4 | 2 |
| 2020 | 2 | 6 |
| 2021 | 3 | 7 |
| 2022 | 4 | 5 |
| 2023 | 9 | 7 |
| 2024 | 7 | 3 |
| 2025 | 3 | 5 |
| 2026 | 0 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device including wire16 Dec 2025US 12,500,970 B2Samsung Electronics Co., Ltd.
- Method for producing a waveguide, circuit device and radar system14 Oct 2025US 12,444,821 B2Infineon Technologies AG
- Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface3 Jun 2025US 12,324,091 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Integrated circuit package with integrated waveguide launcher27 Aug 2024US 12,074,124 B2NXP B. V.
- Electromagnetic wave transmission board comprising an inner board with a plated through hole covered by outer plates, where the electromagnetic waves propagate in the through hole without leakage27 Aug 2024US 12,074,357 B2Boardtek Electronics Corporation
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Component Carrier With Vertically Connected Cavity Sub-Portions30 Jul 2026US 2026/0223704 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Photonic wafer scale interposer with angled beam grating couplers30 Apr 2026US 2026/0121754 A1Volantis Semiconductor, Inc.
- Electronic device including wire16 Apr 2026US 2026/0106925 A1Samsung Electronics Co., Ltd.
- Laminate substrate for a radiofrequency device2 Apr 2026US 2026/0094973 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Voltage tunable laminated dielectric materials for microwave applications171US 6,377,142 B1Paratek Microwave, Inc. · 2002
- Microstrip line of different widths, ground planes of different distances29US 9,405,064 B2Texas Instruments Incorporated · 2016
- Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips29US 9,537,199 B2International Business Machines Corporation · 2017
- Printed circuit board having integral waveguide26US 6,185,354 B2Motorola, Inc. · 2001
- Transmission device and method for manufacturing same, and wireless transmission device and wireless transmission method23US 8,848,389 B2Sony Corporation · 2014