Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips

A package structure, comprising:

• a package substrate comprising an integrated waveguide;
• a first integrated circuit chip and a second integrated circuit chip mounted to the package substrate;
• and
• an application board;
• wherein the first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition;
• wherein the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition;
• wherein the first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide of the package substrate;
• wherein the package substrate comprising the integrated waveguide is mounted to the application board such that the package substrate serves as an interposer between the application board and the first and second integrated circuit chips;
• wherein the package substrate comprises a plurality of conductive vias formed through the package substrate, and wiring patterns formed on surfaces of the package substrate;
• and
• wherein the conductive vias and the wiring patterns of the package substrate are configured to route low frequency signals between the first and second integrated circuit chips and between the application board and the first and second integrated circuit chips, and to distribute DC power from the application board to the first and second integrated circuit chips.