Microstrip line of different widths, ground planes of different distances
AssigneeTexas Instruments Incorporated
InventorsJuan A. Herbsommer, Robert F. Payne, Marco Corsi, Baher S. Haroun, Hassan Ali
Life of this patent
Estimating the term…
Abstract
An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
Claims12
An assembly comprising:
- (A) a microstrip line of conductive material, the microstrip line having a first portion with a first width and a second portion with a second width greater than the first width;
- (B) an integrated circuit electrically coupled to the first portion of the microstrip line;
- (C) a first ground plane of conductive material under the integrated circuit and extending out from under the integrated circuit and under the first portion of the microstrip line and not under the second portion of the microstrip line at a first distance under the microstrip line;
- (D) a second ground plane of conductive material electrically coupled to the first ground plane and extending under and beyond the second portion of the microstrip line at a second distance under the microstrip line greater than the first distance;
- (E) a base substrate having a top surface;
- and
- (F) a dielectric waveguide having a dielectric core and dielectric cladding around the core, the core having one surface formed on the top surface of the substrate, and a first end portion of the dielectric core being coupled to the second portion of the microstrip line over the second ground plane.
Dependencies are inferred from the claim text.