Integrated circuit package with integrated waveguide launcher
AssigneeNXP B.V.
InventorsAbdellatif Zanati, Adrianus Buijsman, Dominik Xaver Simon
Life of this patent
Estimating the term…
Abstract
An integrated circuit package comprising an encapsulant, a semiconductor die in the encapsulant the semiconductor die comprising a plurality of die terminals, an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals and a land grid array provided on a bottom surface of the package. The land grid array comprises a plurality of package terminals, each package terminal configured to be soldered to a printed circuit board, and an opening, wherein the opening is aligned with the integrated waveguide launcher.
Claims17
An integrated circuit package comprising:
- an encapsulant;
- a semiconductor die in the encapsulant, the semiconductor die comprising a plurality of die terminals;
- an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals;
- and
- a land grid array provided on a bottom surface of the package, the land grid array comprising:
- a plurality of package terminals, each package terminal configured to be soldered to a connection;
- a metal pad substantially surrounded by the plurality of package terminals;
- and
- an opening formed in the metal pad, wherein the opening is aligned with the integrated waveguide launcher.
A semiconductor device, comprising:
- an integrated circuit comprising:
- an encapsulant;
- a semiconductor die in the encapsulant, the semiconductor die comprising a plurality of die terminals;
- an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals;
- and
- a land grid array provided on a bottom surface of the package, the land grid array comprising:
- a plurality of package terminals, each package terminal configured to be soldered to a connection;
- a metal pad substantially surrounded by the plurality of package terminals;
- and
- an opening formed in the metal pad, wherein the opening is aligned with the integrated waveguide launcher;
- and
- a printed circuit board, PCB, comprising a waveguide, wherein:
- each package terminal is soldered to the PCB;
- and
- the waveguide is aligned with the opening provided in the land grid array.
An integrated circuit package comprising:
- an encapsulant;
- a semiconductor die in the encapsulant, the semiconductor die comprising a plurality of die terminals;
- an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals;
- and
- a land grid array provided on a bottom surface of the package, the land grid array comprising:
- a plurality of package terminals, each package terminal configured to be soldered to a connection;
- a metal pad substantially surrounded by the plurality of package terminals;
- and
- an opening formed in the metal pad, wherein the opening is aligned with the integrated waveguide launcher.
Dependencies are inferred from the claim text.