Laminate substrate for a radiofrequency device
AssigneeSTMicroelectronics International N.V.
InventorsVipin VELAYUDHAN, Deborah COGONI
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Abstract
A laminate substrate for a radio frequency device successively includes: a first metal layer, in which is formed a first slot open at least partially on one of its sides, with a feed line extending into the first slot; a second metal layer in which is formed a second laterally closed slot; a third metal layer in which is formed a third laterally closed slot; a fourth metal layer in which is formed a fourth laterally closed slot, connection pads being bonded to the fourth metal layer; the second slot, the third slot, and the fourth slot forming a vertical RF feedthrough; and a metal plate being positioned in the fourth slot.
Claims17
A laminate substrate for a radio frequency device, comprising from a first main surface to a second main surface:
- a first metal layer in which is formed a first slot open at least partially on one of its sides, and a feed line, arranged coplanar with the first metal layer and extending into the first slot;
- a first dielectric layer;
- a second metal layer in which is formed a second, laterally closed slot;
- a second dielectric layer;
- a third metal layer in which is formed a third laterally closed slot;
- a third dielectric layer;
- a fourth metal layer in which is formed a fourth laterally closed slot, the second slot, the third slot, and the fourth slot forming a vertical radio frequency feedthrough in the laminate substrate;
- and
- a metal plate being positioned in at least the fourth slot.
Dependencies are inferred from the claim text.