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US 12,324,091 B2Granted
Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsSebastian Sattler, Simon Pressler, Heinrich Trischler
Life of this patent
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Abstract
A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a microwave structure embedded at least partially in the stack. The microwave structure configured for exciting a microwave propagation mode and having at least two stack pieces being interconnected with each other at an electrically conductive connection interface.
Claims15
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- and
- a microwave structure embedded at least partially in the stack, and configured for exciting a microwave propagation mode;
- wherein the stack with the microwave structure is composed of at least two stack pieces being interconnected with each other at an electrically conductive connection interface;
- wherein the at least two stack pieces are interconnected with each other by an electrically conductive connection medium and an electrically insulating layer structure;
- wherein the electrically conductive connection medium and the electrically insulating layer structure are arranged side-by-side.
3 more elements
A method of manufacturing a component carrier, the method comprising:
- providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- embedding a microwave structure configured for exciting a microwave propagation mode, at least partially in the stack;
- and
- interconnecting at least two stack pieces with each other at an electrically conductive connection interface, the at least two stack pieces forming the stack with the microwave structure;
- wherein the at least two stack pieces are interconnected with each other by an electrically conductive connection medium and an electrically insulating layer structure;
- wherein the electrically conductive connection medium and the electrically insulating layer structure are arranged side-by-side.
3 more elements
A method, comprising:
- providing a component carrier, the component carrier having a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- embedding a microwave structure embedded at least partially in the stack the microwave structure configured for exciting a microwave propagation mode;
- wherein the stack with the microwave structure is composed of at least two stack pieces being interconnected with each other at an electrically conductive connection interface;
- wherein the at least two stack pieces are interconnected with each other by an electrically conductive connection medium and an electrically insulating layer structure;
- wherein the electrically conductive connection medium and the electrically insulating layer structure are arranged side-by-side;
- and
- exciting a microwave propagation mode for a high-frequency application.
4 more elements
Dependencies are inferred from the claim text.