US 12,074,357 B2Granted

Electromagnetic wave transmission board comprising an inner board with a plated through hole covered by outer plates, where the electromagnetic waves propagate in the through hole without leakage

AssigneeBoardtek Electronics Corporation

InventorChung-Hsing Liao

Life of this patent

Estimating the term…

Loading patent…

Abstract

An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.

Claims19

Dependent claims

An electromagnetic wave transmission board comprising:

an inner board defining a first through hole, wherein a wall of the first through hole is provided with a plated metal layer;
a first outer plate disposed on a side of the inner board and covering one end of the first through hole;
a second outer plate disposed on a side of the inner board away from the first outer plate and covering another end of the first through hole;
a first plated bump disposed between the inner plate and the first outer plate, the first plated bump surrounding the first through hole;
a first conductive bump sandwiched between the inner plate and the first outer plate, the first conductive bump surrounding the first plate bump;
a first adhesive layer sandwiched between the inner plate and the first outer plate and located on a side of the first conductive bump away from the first plated bump;
a second plated bump disposed between the inner plate and the second outer plate, the second plated bump surrounding the first through hole;
a second conductive bump sandwiched between the inner plate and the second outer plate, the second conductive bump surrounding the second plated bump;
and
a second adhesive layer sandwiched between the inner plate and the second outer plate and disposed on a side of the second conductive bump away from the second plated bump;
wherein the plated metal layer, the first plated bump, the first conductive bump, the first outer plate, the second plated bump, the second conductive bump, and the second outer plate cooperatively form a chamber, the electromagnetic wave transmission board is configured to transmit electromagnetic wave signal through the chamber.

8 more elements

A method of manufacturing an electromagnetic wave transmission bord comprising:

providing an inner plate defining a first through hole penetrating through opposite sides thereof, a wall of the first through hole being provided with a plated metal layer;
providing a first substrate, electroplating a first plated bump on one of the first substrate and the inner plate, and printing a first conductive bump on the other one of the first substrate and the inner plate;
providing a second substrate, electroplating a second plated bump on one of the second substrate and the inner plate, and printing a second conductive bump on the other one of the second substrate and the inner plate;
providing a first adhesive layer with a first opening and a second adhesive layer with a second opening, wherein each of the first conductive bump and the first plated bump extends through the first opening, each of the second conductive bump and the second plated bump to extends through the second opening;
laminating the first substrate, the first adhesive layer, the inner plate, the second adhesive layer, and the second substrate together in that order, wherein the first plated bump is disposed between the inner plate and the first outer plate, the first plated bump surrounds the first through hole, the first conductive bump is sandwiched between the inner plate and the first outer plate, the first conductive bump surrounds the first plate bump, the second plated bump is disposed between the inner plate and the second outer plate, the second plated bump surrounds the first through hole, the second conductive bump is sandwiched between the inner plate and the second outer plate, the second conductive bump surrounds the second plated bump;
and
forming a first outer plate and a second outer plate from the first substrate and the second substrate respectively.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/389,605Filed 30 Jul 2021
Priority: TW 11012688221 Jul 2021
Published: US 2023/0025696 A126 Jan 2023
Granted: 27 Aug 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification26 codes

H01P 3/121
Hollow waveguides: integrated in a substrate
H01Q 9/0457
With particular feeding means: electromagnetically coupled to the feed line
H01P 5/107
For coupling balanced lines or devices with unbalanced lines or devices: hollow-waveguide/strip-line transitions
H01Q 1/2283
By structural association with other equipment or articles: mounted in or on the surface of a semiconductor substrate as a chip-type antenna or…