H05K 2201/0335
Layered conductors or foils
H05K2201/0335 (Layered conductors or foils) appears on 3,546 US grants and 3,361 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,546
- Published applications
- 3,361
- Assignees
- 1,124
- Inventors
- 6,919
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 24 | 0 |
| 1977 | 11 | 0 |
| 1978 | 10 | 0 |
| 1979 | 1 | 0 |
| 1980 | 15 | 0 |
| 1981 | 14 | 0 |
| 1982 | 23 | 0 |
| 1983 | 24 | 0 |
| 1984 | 28 | 0 |
| 1985 | 30 | 0 |
| 1986 | 30 | 0 |
| 1987 | 31 | 0 |
| 1988 | 37 | 0 |
| 1989 | 43 | 0 |
| 1990 | 45 | 0 |
| 1991 | 46 | 0 |
| 1992 | 65 | 0 |
| 1993 | 48 | 0 |
| 1994 | 62 | 0 |
| 1995 | 66 | 0 |
| 1996 | 62 | 0 |
| 1997 | 52 | 0 |
| 1998 | 95 | 0 |
| 1999 | 84 | 0 |
| 2000 | 95 | 0 |
| 2001 | 108 | 59 |
| 2002 | 136 | 142 |
| 2003 | 115 | 126 |
| 2004 | 121 | 174 |
| 2005 | 99 | 188 |
| 2006 | 98 | 161 |
| 2007 | 90 | 180 |
| 2008 | 80 | 173 |
| 2009 | 86 | 223 |
| 2010 | 113 | 186 |
| 2011 | 119 | 145 |
| 2012 | 146 | 123 |
| 2013 | 119 | 100 |
| 2014 | 109 | 100 |
| 2015 | 76 | 131 |
| 2016 | 78 | 101 |
| 2017 | 96 | 82 |
| 2018 | 73 | 77 |
| 2019 | 79 | 86 |
| 2020 | 86 | 101 |
| 2021 | 85 | 114 |
| 2022 | 94 | 129 |
| 2023 | 84 | 125 |
| 2024 | 95 | 105 |
| 2025 | 72 | 78 |
| 2026 | 48 | 152 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/0355Metal foilsIndexing code1,686
- H05K 2201/0347OverplatingIndexing code662
- H05K 2201/0338Layered conductorIndexing code607
- H05K 2201/0352Differences between the conductors of different layers of a multilayerIndexing code343
- H05K 2201/035Paste overlayer, i.e. conductive paste or solder paste over conductive layerIndexing code266
- H05K 2201/0358Resin coated copper [rcc]Indexing code188
- H05K 2201/0344Electroless sublayerIndexing code97
- H05K 2201/0341Intermediate metalIndexing code95
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Resin composition, prepreg, layered sheet, printed circuit board, and semiconductor package17 Sep 2026US 2026/0282221 A1Resonac Corporation
- Component carrier with stacked electrically conductive layers, embedded and on the surface17 Sep 2026US 2026/0282223 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board and package substrate comprising same17 Sep 2026US 2026/0282243 A1LG Innotek Co., Ltd.
- Circuit board and display device provided with same17 Sep 2026US 2026/0282679 A1Sharp Display Technology Corporation
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993