H05K 2201/0347
Overplating
Official title: Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
H05K2201/0347 (Overplating) appears on 662 US grants and 489 published applications in this corpus.
Search patents in H05K- Granted patents
- 662
- Published applications
- 489
- Assignees
- 279
- Inventors
- 1,413
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 7 | 0 |
| 1984 | 8 | 0 |
| 1985 | 5 | 0 |
| 1986 | 8 | 0 |
| 1987 | 6 | 0 |
| 1988 | 10 | 0 |
| 1989 | 11 | 0 |
| 1990 | 11 | 0 |
| 1991 | 10 | 0 |
| 1992 | 12 | 0 |
| 1993 | 8 | 0 |
| 1994 | 21 | 0 |
| 1995 | 14 | 0 |
| 1996 | 13 | 0 |
| 1997 | 16 | 0 |
| 1998 | 31 | 0 |
| 1999 | 24 | 0 |
| 2000 | 27 | 0 |
| 2001 | 23 | 4 |
| 2002 | 23 | 19 |
| 2003 | 22 | 20 |
| 2004 | 19 | 39 |
| 2005 | 20 | 49 |
| 2006 | 25 | 27 |
| 2007 | 22 | 32 |
| 2008 | 18 | 29 |
| 2009 | 21 | 45 |
| 2010 | 17 | 41 |
| 2011 | 17 | 20 |
| 2012 | 37 | 16 |
| 2013 | 19 | 6 |
| 2014 | 14 | 10 |
| 2015 | 8 | 14 |
| 2016 | 7 | 9 |
| 2017 | 5 | 4 |
| 2018 | 8 | 7 |
| 2019 | 5 | 13 |
| 2020 | 9 | 11 |
| 2021 | 12 | 14 |
| 2022 | 12 | 16 |
| 2023 | 10 | 16 |
| 2024 | 9 | 12 |
| 2025 | 10 | 8 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board21 Jul 2026US 12,690,129 B2Nitto Denko Corporation
- Printed circuit board and preparation method thereof, and electronic communication device19 May 2026US 12,635,068 B2Huawei Technologies Co., Ltd.
- Wiring board21 Apr 2026US 12,610,465 B2Shinko Electric Industries Co., Ltd.
- Printed circuit board7 Apr 2026US 12,598,702 B2Samsung Electro-Mechanics Co., Ltd.
- Electronic device24 Mar 2026US 12,586,611 B2Kabushiki Kaisha Toshiba
- Printed circuit board and preparation method thereof, and electronic communication device20 Aug 2026US 2026/0247524 A1Huawei Technologies Co., Ltd.
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Circuit module and soldered circuit module2 Jul 2026US 2026/0190230 A1Murata Manufacturing Co., Ltd.
- Assembly with an electric feedthrough and method for the production thereof28 May 2026US 2026/0150190 A1Schott AG
- Circuit structure and manufacturing method thereof26 Mar 2026US 2026/0089837 A1Siliconware Precision Industries Co., Ltd.
Most cited
By later US patents
- Electroless nickel polyalloys269US 4,397,812 ARichardson Chemical Company · 1983
- Electrolessly plated product having a polymetallic catalytic film underlayer266US 4,632,857 ARichardson Chemical Company · 1986
- Method of preparing substrate surface for electroless plating and products produced thereby260US 4,232,060 ARichardson Chemical Company · 1980
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Method of making microelectronic spring contact elements226US 6,184,053 B2FormFactor, Inc. · 2001