Wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorHiroshi Yokota
Life of this patent
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AssigneeShinko Electric Industries Co., Ltd.
InventorHiroshi Yokota
Estimating the term…
A wiring board includes an insulating layer, first and second pads provided on the insulating layer and including a first surface in contact with the insulating layer, a second surface opposite to the first surface, and a side surface connecting the first and second surfaces, respectively, and a protective insulating layer provided above the insulating layer. The first and second pads have a portion exposed inside an opening in the protective insulating layer. The first pad has a portion opposing the second pad without the protective insulating layer interposed between the first and second pads. A region of the second surface of the first and second pads exposed from the protective insulating layer is covered with a plating layer. A region of the side surface of the first and second pads exposed from the protective insulating layer is exposed from the plating layer.
A wiring board comprising:
Dependencies are inferred from the claim text.