Electronic device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsNobuhiro Yamamoto, Masahide Takazawa
Life of this patent
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Abstract
According to one embodiment, an electronic device includes a wall and a substrate. The substrate is provided with an opening. The substrate includes an organic compound layer, a first surface of the organic compound layer, a second surface of the organic compound layer opposite the first surface, first wiring on the second surface, second wiring on the second surface, a first pad, and a second pad. The first surface is attached to the wall. The first pad is connected to the first wiring. The second pad is connected to the second wiring away from the first pad. The opening penetrates the organic compound layer to open to the first surface and the second surface between the first pad and the second pad.
Claims12
An electronic device comprising:
- a wall;
- and
- a substrate with an opening, including
- an organic compound layer,
- a first surface of the organic compound layer, the first surface attached to the wall,
- a second surface of the organic compound layer, the second surface opposite the first surface,
- first wiring on the second surface,
- second wiring on the second surface,
- a first pad connected to the first wiring, and
- a second pad connected to the second wiring away from the first pad, wherein the opening penetrates the organic compound layer to open to the first surface and the second surface between the first pad and the second pad, wherein
- the first pad has a first edge extending in a first direction along the second surface and facing the second pad,
- the second pad has a second edge extending in the first direction and facing the first edge,
- the opening extends between the entire first edge and at least a part of the second edge, and
- the wall is provided with a hole communicating with the opening.
Dependencies are inferred from the claim text.