Wiring circuit board
AssigneeNitto Denko Corporation
InventorsHideki Matsui, Naoki Shibata, Ryosuke Sasaoka
Life of this patent
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Abstract
A wiring circuit board includes a first insulating layer, a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal, and a second insulating layer for suppressing release of the terminal from the first insulating layer. The second insulating layer has a first portion disposed at the one side of the first insulating layer in the thickness direction and a second portion disposed at one side of a peripheral edge portion of the terminal in the thickness direction and covering the peripheral edge portion.
Claims9
A wiring circuit board comprising:
- a first insulating layer;
- a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal;
- and
- a second insulating layer for suppressing release of the terminal from the first insulating layer, the second insulating layer having a first portion disposed at the one side of the first insulating layer in the thickness direction and a second portion disposed at the one side of a peripheral edge portion of the terminal in the thickness direction and covering the peripheral edge portion,
- wherein the terminal has
- a connecting portion disposed in a central part of the terminal and surrounded by the peripheral edge portion, the connecting portion in which the second insulating layer is not disposed.
Dependencies are inferred from the claim text.