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US 12,598,702 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJin Young Choi
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes an insulating layer having first and second surfaces opposite to each other with respect to a first direction; a via hole penetrating a region between the first and second surfaces; a first conductor layer including a first contact portion in contact with the first surface and a first non-contact portion protruding from the first contact portion and disposed on the via hole with respect to a second direction perpendicular to the first direction; and a metal layer filling the via hole.
Claims20
A printed circuit board, comprising:
- an insulating layer having first and second surfaces facing each other along a first direction;
- a via hole penetrating a region between the first and second surfaces so as to extend from the first surface to reach the second surface of the insulating layer;
- a first conductor layer including:
- a first contact portion in contact with the first surface;
- and
- a first non-contact portion disposed on the via hole and protruding from the first contact portion along a second direction perpendicular to the first direction;
- a metal layer filling the via hole;
- and
- a second conductor layer including a second contact portion in contact with the second surface,
- wherein the first non-contact portion includes a lower surface in contact with a portion of the metal layer above the second surface in the first direction, and
- the second conductor layer further includes a second non-contact portion protruding from the second contact portion along the second direction and disposed on the via hole on a side facing the first non-contact portion along the first direction.
8 more elements
A printed circuit board, comprising:
- an insulating layer;
- a via metal layer penetrating a region between upper and lower surfaces of the insulating layer so as to extend from the upper surface to reach the lower surface of the insulating layer;
- a first conductor layer disposed on an upper surface of the insulating layer and extending partially upwardly of the via metal layer to cover a portion of an upper side of the via metal layer;
- and
- a second conductor layer disposed on a lower surface of the insulating layer and partially extending downwardly of the via metal layer to cover a portion of a lower side of the via metal layer,
- wherein the first conductor layer includes a lower surface in contact with a portion of the via metal layer above the lower surface of the insulating layer to define an interface between the lower surface of the first conductor layer and the portion of the via metal layer, and
- at least a portion of the lower side of the via metal layer does not contact the second conductor layer.
4 more elements
A printed circuit board, comprising:
- an insulating layer having first and second surfaces facing each other along a first direction;
- a via hole penetrating a region between the first and second surfaces so as to extend from the first surface to reach the second surface of the insulating layer;
- a first conductor layer including:
- a first contact portion in contact with the first surface;
- and
- a first non-contact portion disposed on the via hole and protruding from the first contact portion along a second direction perpendicular to the first direction;
- a second conductor layer including a second contact portion in contact with the second surface;
- and
- a metal layer filling the via hole,
- wherein the first and second conductor layers have first and second openings on the via hole, respectively, and a width of each of the first and second openings is different from each other on a cross-section of the printed circuit board, and
- wherein the first non-contact portion includes a lower surface in contact with a portion of the metal layer above the second surface in the first direction.
8 more elements
Dependencies are inferred from the claim text.