H05K 2201/0358
Resin coated copper [rcc]
Official title: Resin coated copper [RCC]
H05K2201/0358 (Resin coated copper [rcc]) appears on 188 US grants and 212 published applications in this corpus.
Search patents in H05K- Granted patents
- 188
- Published applications
- 212
- Assignees
- 137
- Inventors
- 552
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 5 | 0 |
| 2001 | 3 | 6 |
| 2002 | 11 | 10 |
| 2003 | 10 | 6 |
| 2004 | 7 | 11 |
| 2005 | 3 | 10 |
| 2006 | 2 | 8 |
| 2007 | 6 | 11 |
| 2008 | 2 | 14 |
| 2009 | 7 | 12 |
| 2010 | 7 | 17 |
| 2011 | 8 | 6 |
| 2012 | 6 | 11 |
| 2013 | 7 | 10 |
| 2014 | 7 | 7 |
| 2015 | 3 | 5 |
| 2016 | 3 | 7 |
| 2017 | 5 | 5 |
| 2018 | 4 | 9 |
| 2019 | 6 | 5 |
| 2020 | 5 | 7 |
| 2021 | 8 | 8 |
| 2022 | 7 | 14 |
| 2023 | 5 | 2 |
| 2024 | 5 | 6 |
| 2025 | 6 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and package substrate comprising same7 Jul 2026US 12,677,382 B2LG Innotek Co., Ltd.
- Circuit board and method of manufacturing the same16 Jun 2026US 12,660,093 B2LG Innotek Co., Ltd.
- Multilayer substrate and method of manufacturing multilayer substrate24 Feb 2026US 12,563,677 B2Murata Manufacturing Co., Ltd.
- Layered plate and wiring base board production method29 Jul 2025US 12,376,235 B2
- Resin composition, copper foil with resin, and printed wiring board17 Jun 2025US 12,331,212 B2Mitsui Mining & Smelting Co., Ltd.
- Circuit board and package substrate comprising same17 Sep 2026US 2026/0282243 A1LG Innotek Co., Ltd.
- Components-mounting substrate, components-mounting substrate manufacturing method, electronic module, and electronic module manufacturing method4 Jun 2026US 2026/0156757 A1NHK Spring Co., Ltd.
- Printed wiring board25 Dec 2025US 2025/0393124 A1Ibiden Co., Ltd.
- Laminate6 Nov 2025US 2025/0340045 A1ZACROS Corporation
- Substrate with buried glass core18 Sep 2025US 2025/0294685 A1QUALCOMM Incorporated
Most cited
By later US patents
- Method for manufacturing build-up multi-layer printed circuit board by using yag laser130US 6,405,431 B1Samsung Electro-Mechanics Co., Ltd. · 2002
- Enhancement of polyimide adhesion on reactive metals96US 5,114,757 A1992
- Method of fabricating printed circuit board having embedded multi-layer passive devices86US 7,293,356 B2Samsung Electro-Mechanics Co., Ltd. · 2007
- Process for producing multilayer printed circuit board for wire bonding71US 5,879,568 AHitachi, Ltd. · 1999
- Method for manufacturing multi-layer printed circuit board70US 6,119,335 ASamsung Electro-Mechanics Co., Ltd. · 2000