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US 12,331,212 B2Granted
Resin composition, copper foil with resin, and printed wiring board
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsKazuhiro Oosawa, Ayumu Tateoka, Kuniharu Ogawa, Haruka Makino
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Abstract
There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water-resistant reliability. This resin composition includes an arylene ether compound having a weight average molecular weight of 30000 or higher and a styrenic copolymer having, in its molecule, a reactive unsaturated bond that exhibits reactivity by heat or an ultraviolet ray.
Claims7
A resin composition comprising:
- an arylene ether compound having a weight average molecular weight of 30000 or higher;
- and
- a styrenic copolymer having, in its molecule, a reactive unsaturated bond that exhibits reactivity by heat or an ultraviolet ray, wherein the reactive unsaturated bond is at least one selected from the group consisting of a cyanate group, a maleimide group, a vinyl group, a (meth)acryloyl group, an ethynyl group, and a styryl group;
- wherein a content of the arylene ether compound is 25 parts by weight or more and 60 parts by weight or less based on 100 parts by weight of the total amount in terms of solid content of resin components of the resin composition;
- and
- wherein a content of the styrenic copolymer is 10 parts by weight or more and 43 parts by weight or less, based on 100 parts by weight of the total amount in terms of solid content of resin components of the resin composition.
3 more elements
Dependencies are inferred from the claim text.