Back to results
US 7,293,356 B2Granted
Method of fabricating printed circuit board having embedded multi-layer passive devices
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Hyun Sohn, Yul Kyo Chung, Hyun Ju Jin, Eun Tae Park
Life of this patent
Estimating the term…
Abstract
The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.
Claims6
A method of fabricating a printed circuit board having embedded multi-layer passive devices, comprising the steps of:
- applying an insulating layer on a base substrate constituting a core layer, and then laminating a resin coated copper (RCC) having a lower electrode layer on the insulating layer;
- removing an upper copper foil of the RCC, and forming an inner electrode layer;
- repeating the laminating of the RCC in the applying and removing steps several times, to form a plurality of dielectric layers and a plurality of inner electrode layers;
- and
- forming a plurality of via holes through the printed circuit board having the plurality of dielectric layers and the plurality of inner electrode layers, and plating inner walls of the via holes to electrically conductively connect the inner electrode layers.
2 more elements
A method of fabricating a printed circuit board having embedded multi-layer passive devices, comprising the steps of:
- applying an insulating layer on a base substrate constituting a core layer, and forming a lower electrode layer;
- forming an insulating layer and an inner electrode layer on the lower electrode layer using an ultrathin foil carrier;
- processing a via hole through the printed circuit board having the insulating layer and the inner electrode layer to electrically connect inner electrode layers;
- and
- repeating the forming and processing steps to form a plurality of insulating layers and a plurality of inner electrode layers.
2 more elements
Dependencies are inferred from the claim text.