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US 12,677,382 B2Granted
Circuit board and package substrate comprising same
AssigneeLG Innotek Co., Ltd.
InventorsJong Bae Shin, Soo Min Lee, Jae Hun Jeong
Life of this patent
Estimating the term…
Abstract
A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.
Claims17
A circuit board, comprising:
- a first insulating layer including an upper surface and a lower surface;
- a second insulating layer disposed on the first insulating layer and including a cavity;
- a circuit pattern embedded in the second insulating layer;
- a solder resist disposed on the second insulating layer and including a through hole;
- and
- an electric device disposed in the cavity of the second insulating layer, wherein the second insulating layer includes an inner wall surface forming the cavity, wherein the upper surface of the first insulating layer includes an overlapped surface that overlaps the cavity in a vertical direction, wherein the inner wall surface includes a first surface having a first inclination angle with respect to the overlapped surface, a second surface disposed on the first surface and having a second inclination angle different from the first inclination angle with respect to the overlapped surface, and a contact portion in which the first surface and the second surface are in contact, wherein the circuit pattern includes:
- a first via electrode that overlaps the first surface of the cavity along a horizontal direction;
- a second via electrode that is disposed on the first via electrode and does not overlap the first surface along the horizontal direction, and overlaps the second surface along the horizontal direction;
- and
- a wiring part that is disposed between the first via electrode and the second via electrode and does not overlap the first surface along the horizontal direction, and overlaps the second surface along the horizontal direction, wherein the wiring part is in contact the first via electrode and the second via electrode, wherein at least a portion of the through hole of the solder resist overlaps the cavity along the vertical direction, and wherein the electric device overlaps the first via electrode, the second via electrode, the wiring part, and the contact portion along the horizontal direction.
7 more elements
A circuit board, comprising:
- a first insulating layer including an upper surface and a lower surface;
- a second insulating layer disposed on the first insulating layer and including a cavity;
- a circuit pattern embedded in the second insulating layer;
- an electric device disposed in the cavity of the second insulating layer;
- and
- a solder resist disposed on the second insulating layer and including a through hole, wherein the second insulating layer includes an inner wall surface forming the cavity, wherein the upper surface of the first insulating layer includes an overlapped surface that overlaps the cavity in a vertical direction, wherein the inner wall surface includes a first surface having a first inclination angle with respect to the overlapped surface, a second surface disposed on the first surface and having a second inclination angle smaller than the first inclination angle with respect to the overlapped surface, and a contact portion in which the first surface and the second surface are in contact, wherein the circuit pattern includes:
- a first via electrode that overlaps the first surface of the cavity along a horizontal direction;
- a second via electrode that is disposed on the first via electrode and does not overlap the first surface along the horizontal direction, and overlaps the second surface along the horizontal direction;
- and
- a wiring part that is disposed between the first via electrode and the second via electrode and does not overlap the first surface along the horizontal direction, and overlaps the second surface along the horizontal direction, wherein the wiring part is in contact the first via electrode and the second via electrode, wherein at least a portion of the through hole of the solder resist overlaps the cavity along the vertical direction, wherein the first inclination angle and the second inclination angle exceed 90 degree with respect to the overlapped surface, and wherein the electric device overlaps the first via electrode, the second via electrode, the wiring part, the first surface, the second surface, and the contact portion along the horizontal direction.
7 more elements
Dependencies are inferred from the claim text.