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US 2025/0393124 A1Published application
Printed wiring board
AssigneeIbiden Co., Ltd.
InventorsRyo ANDO, Yuto TAMURA
Life of this patent
Estimating the term…
Abstract
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer. The conductor layer includes a main component including copper such that the conductor layer includes a copper oxide film forming a surface thereof.
Claims20
A printed wiring board, comprising:
- an insulating layer;
- a conductor layer formed on the insulating layer;
- an adhesive layer formed on the conductor layer;
- and
- a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer,
- wherein the conductor layer includes a main component comprising copper such that the conductor layer includes a copper oxide film forming a surface thereof.
3 more elements
Dependencies are inferred from the claim text.