Method for manufacturing build-up multi-layer printed circuit board by using yag laser

A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

• forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, said CCL having a copper foil on the one face thereof;
• primarily stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern formed thereon, and heating and pressing this structure;
• forming a second printed circuit pattern on the board with said RCC primarily stacked thereon by applying the general photo-etching process;
• secondarily stacking RCC on the board with said second printed circuit pattern formed thereon, and heating and pressing this structure;
• irradiating a YAG laser to the board with said RCC stacked secondarily so as to form a via hole at a predetermined position by removing said RCC stacked primarily and secondarily;
• carrying out an electroless and electro copper plating on the board with said via hole formed therein, to form a plated layer;
• and
• forming a third printed circuit pattern on said plated layer so as to electrically connect the layers on which said first to third printed circuit patterns are formed, wherein the thickness of the copper foil constituting said CCL is 3-35 μm, the thickness of said RCC is at least 40-100 μm, the process conditions of said YAG laser should satisfy the output of preferably 300-5000 mW and the wavelength of preferably 200-1,500 nm, said via hole is formed in the diameter of 25-200 μm and the depth of 40-300 μm, and said electroplated layer is formed in thickness of 7-25 μm.

A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

• forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process respectively, said CCL having copper foils on both faces thereof;
• stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern formed thereon respectively, and heating and pressing this structure;
• irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC respectively;
• carrying out an electroless and electro copper plain on the board with said via holes formed therein to form a plated layer;
• forming a second printed circuit pattern on said plated layer so as to electrically connect the layers on which said first and second printed circuit patterns are formed;
• and
• continuously stacking said RCC on the board formed according to said steps to form n printed circuit patterns, wherein the thickness of the copper foil constituting said CCL is 3-35 μm, the thickness of said RCC is 40-100 μm, the process conditions of said YAG laser should satisfy the output power of preferably 300-2000 mW and the wavelength of preferably 200-1,500 nm, said via hole is formed in the diameter of 25-200 μm and the depth of 20-100 μm, and said electroplated layer is formed in thickness of 7-25 μm.

A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

• forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process respectively, said CCL having a copper foil on both faces thereof;
• primarily stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern formed thereon respectively, and heating and pressing this structure;
• forming a second printed circuit pattern on the board with said RCC primarily formed thereon by applying the general photo-etching process;
• secondarily stacking RCC on said second printed circuit pattern formed thereon respectively, and heating and pressing this structure;
• irradiating a YAG laser to the board so as to form a via hole at a predetermined position by removing said RCC stacked primarily and secondarily;
• carrying out an electroless and electro copper plating on the board with said via holes formed therein to form a plated layer;
• forming a third printed circuit pattern on said plated layer so as to electrically connect the layers on which said first to printed circuit patterns are formed;
• and
• continuously stacking said RCC on the board formed according to said steps to form n printed circuit patterns, wherein the thickness of the copper foil constituting said CCL is 3-35 μm, the thickness of said RCC is at least 40-100 μm, the process conditions of said YAG laser should satisfy the output of preferably 300-5000 mW and the wavelength of preferably 200-1,500 nm, said via hole is formed in the diameter of 25-200 μm and the depth of 40-300 μm, and said electroplated layer is formed in thickness of 7-25 μm.

A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

• forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process respectively, said CCL having a copper foil on both faces thereof;
• primarily stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern formed thereon respectively, and heating and pressing this structure;
• irradiating a YAG laser to the board with said RCC stacked so as to form a plated through hole(PTH) at a predetermined position by removing said RCC stacked and said CCL;
• carrying out an electroless and electro copper plating on the board with said PTH formed therein to form a plated layer respectively;
• forming a second printed circuit pattern on said plated layer to electrically connect the upper and lower portions of said second printed circuit pattern;
• secondarily stacking RCC on said second printed circuit pattern formed thereon respectively, and heating and pressing this structure;
• forming a third printed circuit pattern on the board with said RCC stacked secondarily thereon;
• and
• continuously stacking said RCC on the board formed according to said steps to form n printed circuit patterns, wherein the thickness of the copper foil constituting said CCL is 3-35 μm, the thickness of said RCC is at least 40-100 μm, the process conditions of said YAG laser should satisfy the output of preferably 300-5000 mW and the wavelength of preferably 200-1,500 nm, said PTH is formed in the diameter of 25-200 μm and the depth of 400-800 μm, and said electroplated layer is formed in thickness of 7-25 μm.