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US 12,660,093 B2Granted
Circuit board and method of manufacturing the same
AssigneeLG Innotek Co., Ltd.
InventorsMin Young Hwang, Byeong Kyun Choi, Jin Seok Lee, Moo Seong Kim
Life of this patent
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Abstract
A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 μm to 5 μm.
Claims17
A circuit board comprising:
- an insulating layer including an upper surface, a lower surface, and a via hole passing through at least a portion of the insulating layer from the upper surface toward the lower surface;
- and
- a via electrode disposed in the via hole of the insulating layer,
- wherein the insulating layer includes a resin, and fillers dispersed in the resin,
- wherein the fillers include a plurality of first fillers embedded in the insulating layer and not in contact with the via electrode, and a plurality of second fillers in contact with the via electrode,
- wherein the via electrode has a slope in which a width decreases in a horizontal direction from the upper surface toward the lower surface,
- wherein a shape of the plurality of first fillers and a shape of the plurality of second fillers are different from each other,
- wherein the plurality of first fillers and the plurality of second fillers include a same material,
- wherein the via electrode includes a side surface opposite to an inner wall surface of the via hole,
- wherein the side surface of the via electrode includes a stepped portion, and
- wherein the stepped portion overlaps the plurality of second fillers in a horizontal direction.
8 more elements
A circuit board comprising:
- an insulating layer including a resin, and fillers dispersed in the resin,
- wherein the fillers include a plurality of first fillers having a first shape, and a plurality of second fillers having a second shape different than the first shape;
- wherein the plurality of first fillers and the plurality of second fillers include a same material,
- wherein the insulating layer includes an upper surface and a lower surface, and a through hole passing through at least a portion of the insulating layer from the upper surface toward the lower surface,
- wherein the through hole has a slope in which a width decreases in a horizontal direction from the upper surface toward the lower surface,
- wherein at least a portion of each of the plurality of second fillers is not covered with the insulating layer, and
- wherein the plurality of second fillers and the resin form an inner wall surface of the through hole of the insulating layer.
4 more elements
Dependencies are inferred from the claim text.