Substrate with buried glass core

A method of manufacturing an apparatus comprising a package substrate, the method comprising:

• forming a substrate including at least partially embedding a glass block in a copper clad laminate (CCL) core;
• forming a first metallization structure including a plurality of first dielectric layers;
• a plurality of first metal layers;
• and a plurality of first vias configured to couple adjacent metal layers of the plurality of first metal layers through the plurality of first dielectric layers;
• and
• forming a second metallization structure comprising a plurality of second dielectric layers, a plurality of second metal layers and a plurality of second vias configured to couple adjacent metal layers of the plurality of second metal layers through the plurality of second dielectric layers,
• wherein the second metallization structure is disposed on a second side of the substrate opposite the first metallization structure disposed on a first side of the substrate.