Circuit board and package substrate comprising same

A circuit board comprising:

• a first insulating layer;
• a second insulating layer disposed on the first insulating layer and including a cavity;
• a protective insulating layer disposed on the second insulating layer;
• a circuit pattern embedded in the second insulating layer;
• and
• an electronic device disposed in the cavity of the second insulating layer,
• wherein the second insulating layer includes an inner wall surface defining the cavity,
• wherein the inner wall surface includes:
• a first surface having a first inclination angle with respect to an upper surface of the first insulating layer;
• a second surface disposed on the first surface and having a second inclination angle different from the first inclination angle with respect to the upper surface of the first insulating layer;
• and
• a contact portion at which the first surface and the second surface contact each other,
• wherein the circuit pattern includes:
• a first via electrode overlapping the first surface of the cavity in a horizontal direction;
• and
• a wiring portion disposed on the first via electrode and overlapping the second surface in the horizontal direction while not overlapping the first surface in the horizontal direction,
• wherein the electronic device overlaps the first via electrode, the wiring portion, and the contact portion in the horizontal direction.