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US 12,376,235 B2Granted
Layered plate and wiring base board production method
OwnerMasaya Toba, Kazuyuki Mitsukura +1inventors
InventorsMasaya Toba, Kazuyuki Mitsukura, Masaki Yamaguchi
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Abstract
A layered plate including a copper layer having a thickness of 5 μm or less, and a resin layer provided on a surface of the copper layer, in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130° C. in temperature and 85% in relative humidity for 200 hours.
Claims12
A layered plate comprising:
- a copper layer having a thickness of 5 μm or less;
- and
- a resin layer provided on a surface of the copper layer,
- wherein a water absorption rate of the resin layer is 1% or less after being left in an environment of 130° C. in temperature and 85% in relative humidity for 200 hours.
1 more element
A method of manufacturing a circuit board, the method comprising:
- preparing a layered plate which includes a copper layer having a thickness of 5 μm or less, a resin layer, and a support substrate in this order, and in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130° C. in temperature and 85% in relative humidity for 200 hours;
- forming a seed layer on a surface of the copper layer by electroless copper plating;
- forming a resist pattern including a groove reaching a surface of the seed layer on the surface of the seed layer;
- and
- filling the groove with a conductive material containing copper by electrolysis copper plating.
2 more elements
A method of manufacturing a circuit board, the method comprising:
- preparing a layered plate which includes a copper layer having a thickness of 5 μm or less, a resin layer, and a support substrate in this order, and in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130° C. in temperature and 85% in relative humidity for 200 hours;
- forming a first opening reaching a surface of the support substrate through the copper layer and the resin layer;
- forming a seed layer on a surface of the copper layer and a side surface of the first opening by electroless copper plating;
- forming a resist pattern including a second opening communicating with the first opening on a surface of the seed layer;
- and
- filling the first opening and the second opening with a conductive material containing copper by electrolysis copper plating.
3 more elements
Dependencies are inferred from the claim text.