H05K 2201/0341
Intermediate metal
Official title: Intermediate metal, e.g. before reinforcing of conductors by plating
H05K2201/0341 (Intermediate metal) appears on 95 US grants and 120 published applications in this corpus.
Search patents in H05K- Granted patents
- 95
- Published applications
- 120
- Assignees
- 66
- Inventors
- 252
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 2 |
| 2009 | 0 | 9 |
| 2010 | 1 | 2 |
| 2011 | 2 | 4 |
| 2012 | 5 | 7 |
| 2013 | 5 | 6 |
| 2014 | 3 | 7 |
| 2015 | 4 | 10 |
| 2016 | 6 | 9 |
| 2017 | 11 | 5 |
| 2018 | 4 | 5 |
| 2019 | 4 | 10 |
| 2020 | 7 | 5 |
| 2021 | 5 | 11 |
| 2022 | 7 | 12 |
| 2023 | 4 | 4 |
| 2024 | 10 | 3 |
| 2025 | 5 | 4 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board and preparation method thereof, and electronic communication device19 May 2026US 12,635,068 B2Huawei Technologies Co., Ltd.
- Circuit board and method for manufacturing circuit board28 Apr 2026US 12,615,713 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board, light-emitting substrate, backlight module, display panel and display device21 Apr 2026US 12,610,675 B2Boe Technology Group Co., Ltd.
- Wiring board9 Dec 2025US 12,495,486 B2KYOCERA Corporation
- Circuit board and method for manufacturing the same, functional backplate, backlight module and display apparatus14 Oct 2025US 12,446,151 B2Boe Technology Group Co., Ltd.
- Printed circuit board and preparation method thereof, and electronic communication device20 Aug 2026US 2026/0247524 A1Huawei Technologies Co., Ltd.
- Circuit board and light-emitting substrate20 Aug 2026US 2026/0247767 A1Boe Technology Group Co., Ltd.
- Printed circuit board17 Apr 2025US 2025/0126715 A1Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board17 Apr 2025US 2025/0126718 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board20 Mar 2025US 2025/0098059 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Laminated conductive material, multiple conductor cables and methods of manufacturing such cables38US 5,274,195 AAdvanced Circuit Technology · 1993
- Buried resist technique for the fabrication of printed wiring29US 4,312,897 AHughes Aircraft Company · 1982
- Process for producing a printed wiring board20US 5,638,598 AHitachi Chemical Company, Ltd. · 1997
- Transmission line for high performance radio frequency applications19US 9,679,869 B2Skyworks Solutions, Inc. · 2017
- Heat shock resistant printed circuit board assemblies18US 4,303,798 AKollmorgen Technologies Corporation · 1981