Circuit board and method for manufacturing the same, functional backplate, backlight module and display apparatus

A method for manufacturing a circuit board, comprising:

• forming a base substrate;
• forming a wire on the base substrate, wherein the forming a wire comprises forming a first conductive layer;
• and
• forming at least one insulating layer, wherein the at least one insulating layer is arranged on a side of the first conductive layer away from the base substrate and covers the first conductive layer,
• wherein the first conductive layer comprises a first stacked structure on a side away from the base substrate and a second stacked structure proximate to the base substrate, and
• the first stacked structure comprises at least an etch stop layer covering the second stacked structure;
• and
• wherein the first stacked structure comprises the etch stop layer, a first metal layer and a first oxidation barrier layer that are sequentially arranged away from the base substrate;
• and
• wherein an orthographic projection of the etch stop layer on the base substrate, an orthographic projection of the first metal layer on the base substrate, and an orthographic projection of the first oxidation barrier layer on the base substrate overlap with one another.