Wiring board
AssigneeKYOCERA Corporation
InventorHidetoshi Yugawa
Life of this patent
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AssigneeKYOCERA Corporation
InventorHidetoshi Yugawa
Estimating the term…
A wiring board includes an insulation resin layer, and a wiring conductor positioned on the insulation resin layer. The wiring conductor includes a first and second underlying metal layers, a wiring metal layer positioned on the second underlying metal layer, a tin layer positioned covering the first underlying metal layer, the second underlying metal layer, and the wiring metal layer, and a silane coupling agent layer positioned covering the tin layer. When the wiring conductor is seen in a cross section in a width direction, the wiring metal layer includes, from the first underlying metal layer side, a portion with a width narrower than a width of the first underlying metal layer, a portion with a width equal to the width of the first underlying metal layer, and a portion with a width wider than the width of the first underlying metal layer.
A wiring board comprising:
Dependencies are inferred from the claim text.