Circuit board and method for manufacturing circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorSeong Ho Choi
Life of this patent
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Abstract
A circuit board include: a substrate having a first surface including a first region and a second region; a connection pad disposed in the first region and having a first height in a direction perpendicular to the first surface; a circuit wiring disposed in the second region, including different metal films, and having a second height in the direction perpendicular to the first surface to be greater than the first height; and an insulating pattern layer covering the circuit wiring in the second region and protruding from the first surface to have a step from the first region.
Claims20
A circuit board comprising:
- a substrate having a first surface including a first region and a second region;
- a connection pad disposed in the first region and having a first height in a direction perpendicular to the first surface;
- a circuit wiring disposed in the second region, including heterogeneous metal films, and having a second height in the direction perpendicular to the first surface to be greater than the first height;
- and
- an insulating pattern layer protruding from the first surface to have a step from the first region,
- wherein in a cross-section of the circuit board, the insulating pattern layer covers an entire upper surface of one pattern of the circuit wiring in the second region, and
- a lower surface of the one pattern of the circuit wiring faces the substrate, and the upper surface of the one pattern opposes the lower surface in the direction perpendicular to the first surface.
A method for manufacturing a circuit board comprising:
- forming a first conductive layer with a first metal on a first surface of a substrate having a seed layer;
- forming a second conductive layer on the first conductive layer with a second metal that is different from the first metal;
- forming a third conductive layer on the second conductive layer with the first metal;
- defining a first region and a second region that are different from each other on the first surface, and removing the second conductive layer and the third conductive layer disposed in the first region;
- forming a connection pad in the first region by removing a portion in which the first conductive layer is not formed from the seed layer, and forming a circuit wiring in the second region;
- and
- forming an insulating pattern layer covering the circuit wiring in the second region.
A circuit board comprising:
- a substrate;
- a plurality of connection pads and a plurality of circuit wiring patterns disposed on the substrate;
- and
- an insulating pattern layer covering the plurality of circuit wiring patterns and being spaced apart from the plurality of connection pads,
- wherein a height of one of the plurality of circuit wiring patterns is greater than a height of one of the plurality of connection pads, and the one of the plurality of circuit wiring patterns has one or more layers more than the one of the plurality of connection pads,
- in a cross-section of the circuit board, the insulating pattern layer covers an entire upper surface of the one of the plurality of circuit wiring patterns, and
- a lower surface of the one pattern of the circuit wiring faces the substrate, and the upper surface of the one pattern opposes the lower surface in the direction perpendicular to the first surface.
Dependencies are inferred from the claim text.