Transmission line for high performance radio frequency applications
AssigneeSkyworks Solutions, Inc.
InventorsSandra Louise Petty-Weeks, Guohao Zhang, Hardik Bhupendra Modi
Life of this patent
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Abstract
This disclosure relates to a transmission line for high performance radio frequency (RF) applications. One such transmission line can include a bonding layer configured to receive an RF signal, a barrier layer, a diffusion barrier layer, and a conductive layer proximate to the diffusion barrier layer. The diffusion barrier layer can have a thickness that allows a received RF signal to penetrate the diffusion barrier layer to the conductive layer. In certain implementations, the diffusion barrier layer can be nickel. In some of these implementations, the transmission line can include a gold bonding layer, a palladium barrier layer, and a nickel diffusion barrier layer.
Claims26
A radio frequency module comprising:
- a substrate including a transmission line having a bonding layer, a barrier layer, a diffusion barrier layer, and a conductive layer, the bonding layer having a bonding surface bonded with a wire bond, the barrier layer and the diffusion barrier layer configured to prevent a contaminant from entering the bonding layer, and the diffusion barrier layer being a nickel layer having a thickness that is less than about 0.35 um so as to allow substantially all of a radio frequency signal having a frequency of at least about 1.9 GHz received at the bonding surface to propagate in the conductive layer;
- a first radio frequency component implemented on a die coupled to the substrate, the first radio frequency component configured to provide the radio frequency signal having the frequency of at least 1.9 GHz to the wire bond, the wire bond extending from the die to the bonding surface of the transmission line;
- and
- a second radio frequency component coupled to the substrate, the second radio frequency component configured to receive the radio frequency signal having the frequency of at least about 1.9 GHz from the first radio frequency component via the transmission line.
A radio frequency module comprising:
- a substrate including a transmission line having a gold layer, a palladium layer proximate the gold layer, a nickel layer proximate the palladium layer, and a conductive layer proximate the nickel layer, the gold layer having a bonding surface bonded with a wire bond, and the nickel layer having a thickness that is less than 0.35 um;
- a first radio frequency component implemented on a die coupled to the substrate, the first radio frequency component configured to provide a radio frequency signal to the wire bond, the wire bond extending from the die to the bonding surface of the transmission line;
- and
- a second radio frequency component coupled to the substrate, the second radio frequency component configured to receive the radio frequency signal from the first radio frequency component via the transmission line.
A radio frequency module comprising:
- a substrate including a transmission line having a gold layer with a thickness in a range from 0.05 um to 0.15 um, a palladium layer proximate the gold layer, a nickel layer proximate the palladium layer, and a conductive layer proximate the nickel layer, the gold layer having a bonding surface bonded with a wire bond, and the nickel layer having a thickness that is at least 0.04 um and less than 0.35 um;
- a first radio frequency component implemented on a die coupled to the substrate, the first radio frequency component configured to provide a radio frequency signal having a frequency of at least 5 GHz to the wire bond, the wire bond extending from the die to the bonding surface of the transmission line;
- and
- a second radio frequency component coupled to the substrate, the second radio frequency component configured to receive the radio frequency signal from the first radio frequency component via the transmission line.
Dependencies are inferred from the claim text.