Printed circuit board

A printed circuit board, comprising:

• a first substrate including a first antenna pattern;
• a second substrate disposed on the first substrate and including a second antenna pattern;
• a metal layer disposed between the first and second substrates;
• and
• a bonding layer disposed between the first and second substrates,
• wherein at least one of the first and second substrates has a cavity having at least a portion disposed between the first and second antenna patterns, and
• wherein at least a portion of a side surface of the metal layer has a step difference.

A method of manufacturing a printed circuit board, the method comprising:

• preparing a first substrate including a first antenna pattern and including a first metal layer formed on an outermost side thereof;
• forming a first inorganic insulating film covering at least a portion of the first metal layer on the outermost side of the first substrate;
• preparing a second substrate including a second antenna pattern and including a second metal layer formed on an outermost side thereof;
• forming a second inorganic insulating film covering at least a portion of the second metal layer on the outermost side of the second substrate;
• forming a cavity in at least one of the first and second substrates;
• and
• bonding the first and second substrates to each other such that the first and second inorganic insulating films are bonded to each other and the first and second metal layers are bonded to each other,
• wherein each of the first and second substrates includes an organic material.

A printed circuit board, comprising:

• a first substrate including a first antenna pattern;
• a second substrate disposed on a first substrate and including a second antenna pattern;
• a metal layer disposed between the first and second substrates;
• and
• a bonding layer disposed between the first and second substrates and covering side surfaces of the metal layer,
• wherein at least one of the first and second substrates has a cavity having at least a portion disposed between the first and second antenna patterns, and
• wherein a thickness of the bonding layer between the first substrate and the cavity is smaller than a thickness of the bonding layer between the first and second substrates.

A printed circuit board, comprising:

• a first substrate including a plurality of first insulating layers, a plurality of first wiring layers disposed on or in the plurality of first insulating layers, one of the plurality of first wiring layers including a first antenna pattern;
• a second substrate disposed on the first substrate and including a plurality of second insulating layers, a plurality of second wiring layers disposed on or in the plurality of second insulating layers, respectively, and a plurality of second via layers penetrating at least one of the plurality of second insulating layers, respectively, one of the plurality of second insulating layers including a second antenna pattern;
• a metal layer disposed between the first and second substrates;
• and
• a bonding layer disposed between the first and second substrates and covering side surfaces of the metal layer,
• wherein at least one of the first and second substrates has a cavity having at least a portion disposed between the first and second antenna patterns, and
• wherein a via layer among the plurality of first via layers which is connected to the metal layer and a via layer of the plurality of second via layers which is connected to the metal layer are tapered in opposite directions.